The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Jan. 19, 2021
Applicant:

Hong Kong Applied Science and Technology Research Institute Co., Ltd., Shatin, HK;

Inventors:

Jing Xiang, Ma on Shan, HK;

Pau Yee Lim, Ma on Shan, HK;

Laiyong Xie, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/653 (2014.01); H01M 10/613 (2014.01); H01M 10/655 (2014.01);
U.S. Cl.
CPC ...
H01M 10/653 (2015.04); H01M 10/613 (2015.04); H01M 10/655 (2015.04);
Abstract

Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.


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