Tokyo, Japan

Tsutomu Kanno

This inventor holds 2 USPTO granted patents. Top assignee: Dic Corporation. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsutomu Kanno. Retrieved from https://idiyas.com/inventor/tsutomu-kanno-b0cv5vay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 1


Location History:

  • Sakura, JP (2016)
  • Tokyo, JP (2021)

Company Filing History:


Years Active: 2016-2021

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2 patents (USPTO):Explore Patents

Title: Tsutomu Kanno: Innovator in Packaging and Conductive Materials

Introduction

Tsutomu Kanno is a notable inventor based in Tokyo, Japan. He has made significant contributions to the fields of packaging materials and conductive pastes. With a total of 2 patents, Kanno's work focuses on enhancing the performance and durability of materials used in various applications.

Latest Patents

Kanno's latest patents include an innovative adhesive for packaging material and a conductive paste for printing conductive patterns. The adhesive provides a packaging material that maintains high formability and adhesion strength, even after thermal fusion and long-term exposure to high temperature and humidity. This invention is particularly useful for sealing battery elements. The conductive paste is designed for gravure offset printing, ensuring high linearity and preventing disconnections or short circuits in the printed patterns.

Career Highlights

Tsutomu Kanno is currently employed at Dic Corporation, where he continues to develop cutting-edge materials. His work has been instrumental in advancing the technology used in packaging and conductive applications.

Collaborations

Kanno collaborates with talented coworkers, including Yoshinori Katayama and Tomoko Okamoto, to drive innovation within his field.

Conclusion

Tsutomu Kanno's contributions to packaging and conductive materials demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and its applications in modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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