Dic Corporation

Tsutomu Kanno

Hiroki Kobayashi

Yoshinori Katayama

Takatoshi Matsuo

Yasuhiro Sente

Hideaki Takei

Akio Umino

Tomoko Okamoto

Tatsuya Kouyama

Takashi Mihara

Hidemi Nakamura

Seiji Mizuta

The invention provides a packaging material that has high formability and that does not undergo a decrease in the adhesion strength between layers and appearance defects such as lifting between layers even after thermal fusion between portions of the sealant layer performed for sealing battery elements and furthermore after a long-term durability test under high temperature and high humidity. The adhesive for the packaging material including, as essential components, a polyol composition (A) and a polyisocyanate composition (B), wherein the polyol composition (A) includes a polyester polyol made from, as essential materials, a polybasic acid or its derivative and a polyhydric alcohol, the polybasic acid or its derivative material is all an aromatic-ring-containing polybasic acid or its derivative, and the polyester polyol has a number-average molecular weight in a range of 3000 to 100000; a battery packaging material, a battery container, and a battery that use the adhesive.

Adhesive for packaging material, a packaging material, and a container

A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50&#xb0; C. and has a boiling point of more than 300&#xb0; C. at normal pressure; an organic compound (C) that is liquid at 50&#xb0; C. and has a boiling point of more than 300&#xb0; C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170&#xb0; C. to 300&#xb0; C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

Conductive paste, method for forming conductive pattern, and object with printed conductive pattern

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Tokyo, Japan

Tsutomu Kanno