The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Jan. 23, 2014
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yasuhiro Sente, Sakura, JP;

Tsutomu Kanno, Sakura, JP;

Tomoko Okamoto, Sakura, JP;

Yoshinori Katayama, Sakura, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); C09D 5/24 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); C09D 11/037 (2014.01); C09D 11/10 (2014.01); C09D 11/52 (2014.01); C09D 17/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C09D 11/037 (2013.01); C09D 11/10 (2013.01); C09D 11/52 (2013.01); C09D 17/00 (2013.01); H05K 1/092 (2013.01); H05K 1/095 (2013.01); H05K 3/107 (2013.01); H05K 3/1275 (2013.01);
Abstract

A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.


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