Tsung-Yen Tseng

Title: Innovations of Tsung-Yen Tseng in Semiconductor Technology

Introduction

Tsung-Yen Tseng is a notable inventor based in Ping-Tung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the formation of conductive bumps. His innovative methods have the potential to enhance the performance and efficiency of semiconductor devices.

Latest Patents

Tsung-Yen Tseng holds a patent for a "Formation method for conductive bump." This method involves applying a technique to a wafer, where an under-bump-metallurgy structure and a first photo resist layer are formed. The first photo resist layer is patterned to create openings, and a second photo resist layer is filled into these openings. The thickness of the second photo resist layer is equal to or less than that of the first. After patterning the second photo resist layer, a conductive layer is formed in the openings. Both photo resist layers are then removed, allowing the conductive layer to act as a mask for removing the exposed under-bump-metallurgy structure. Finally, the conductive layer is reflowed to create conductive bumps, which benefit from increased heights and decreased pitches due to the use of two types of photo resist layers.

Career Highlights

Tsung-Yen Tseng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor manufacturing. His work has been instrumental in advancing the technology used in the industry.

Collaborations

He has collaborated with notable colleagues, including Zhi-Hao Chen and Chi-Long Tsai, contributing to various projects that enhance semiconductor technology.

Conclusion

Tsung-Yen Tseng's contributions to the field of semiconductor technology, particularly through his patent for the formation of conductive bumps, demonstrate his innovative spirit and commitment to advancing the industry. His work continues to influence the development of more efficient semiconductor devices.