Tsung-Yao Chu

Title: Tsung-Yao Chu: Innovator in Semiconductor Packaging

Introduction

Tsung-Yao Chu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative work focuses on enhancing the efficiency and reliability of electronic substrates.

Latest Patents

Among his latest patents is an invention titled "Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer." This patent describes a single-step bumping and bonding method for forming a semiconductor package that connects two electronic substrates using solder bumps. The method involves a first electronic substrate equipped with conductive pads that have apertures for receiving solder material, allowing for effective bonding with a second substrate.

Another notable patent is the "Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication." This invention details a wafer-level package that utilizes dual stress buffer layers to achieve I/O pad redistribution. The method includes sequentially depositing stress buffer layers on an IC die, followed by forming metal traces to connect I/O pads, thereby enhancing the package's performance.

Career Highlights

Tsung-Yao Chu is affiliated with the Industrial Technology Research Institute, where he continues to advance semiconductor technology. His work has been instrumental in developing innovative solutions that address the challenges in electronic packaging.

Collaborations

He has collaborated with notable colleagues, including Hsin-Chien Huang and Enboa Wu, contributing to various projects that push the boundaries of semiconductor research.

Conclusion

Tsung-Yao Chu's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced electronic technologies.