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Tsung-Yao Chu

USPTO Granted Patents = 6

Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 272(Granted Patents)

Location History:

Hsinchu, TW (1999)
Taipei, TW (2001 - 2002)

Company Filing History:

Industrial Technology Research Institute

Years Active: 1999-2002

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6459150 - Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer (2002-10-01),

2. 6433427 - Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication (2002-08-13),

3. 6365498 - Integrated process for I/O redistribution and passive components fabrication and devices formed (2002-04-02),

4. 6312974 - Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated (2001-11-06),

5. 6197613 - Wafer level packaging method and devices formed (2001-03-06),

6. 5893731 - Method for fabricating low cost integrated resistor capacitor (1999-04-13),

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