The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2002

Filed:

Oct. 15, 1999
Applicant:
Inventors:

Tsung-Yao Chu, Taipei, TW;

Ying-Nan Wen, Hsin-chu, TW;

Szu-Wei Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

The present invention discloses an integrated method for I/O redistribution and in-situ passive components fabrication such that passive components such as resistors and capacitors can be formed simultaneously during the I/O redistribution process. Only minor modifications in the I/O redistribution process need to be made for accomplishing the present invention method. In the method, an adhesion layer formed of a high resistance material such as TiW, TiN, NiCr,or NiV can be used to connect between connective traces and to function as passive resistors. Passive capacitors can be formed by the additional deposition steps of a dielectric layer and a conductive metal layer on top of an existing connective trace formed on a bonding pad.


Find Patent Forward Citations

Chu, Tsung-Yao. (2002). Integrated process for i/o redistribution and passive components fabrication and devices formed (U.S. Patent No. 6365498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6365498

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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