This inventor holds 1 USPTO granted patent. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Ind. (Shenzhen) Co., Ltd.. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2007
Title: **Inventor Spotlight: Tsung Lung Lee**
Introduction
Tsung Lung Lee, hailing from Tu-Chen, Taiwan, is an innovative inventor known for his contributions to thermal management technology. With a strong focus on enhancing electronic component cooling systems, he has developed patents that showcase his technical expertise and inventive spirit.
Latest Patents
Tsung Lung Lee holds a notable patent for a liquid-cooled heat sink assembly designed for cooling electronic components. This invention features a main body that defines a central chamber, equipped with fins on the exterior. It includes a liquid coolant in the central chamber, along with two fans—one within the chamber and another positioned above the main body. This innovative design combines forced liquid cooling with forced airflow cooling, eliminating the need for extra pipes for coolant circulation. As a result, the overall volume of the heat sink assembly is reduced, making it easier to integrate with various electronic components.
Career Highlights
Throughout his career, Tsung Lung Lee has worked with prominent companies in the technology sector. Notable positions include his employment at Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these companies has contributed to his understanding of electronic manufacturing and thermal management solutions.
Collaborations
During his career, Tsung Lung Lee has collaborated with talented coworkers, including Dong Wang and Li He. These professional relationships have helped foster a creative environment, leading to innovative designs and effective solutions in the field of electronic cooling technologies.
Conclusion
Tsung Lung Lee is an influential inventor whose work in liquid-cooled heat sink assemblies exemplifies the intersection of innovation and technology. His patent reflects a significant advancement in cooling systems for electronic components, showcasing his ability to address real-world challenges in the tech industry. As he continues to push the boundaries of invention, the impact of his work will likely be felt for years to come.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile