The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Jul. 27, 2004
Tsung Lung Lee, Tu-Chen, TW;
Dong Wang, Shenzhen, CN;
LI He, Shenzhen, CN;
Shenghua Wang, Shenzhen, CN;
Jian-hua Gu, Shenzhen, CN;
Zhi-gang Liu, Shenzhen, CN;
Tsung Lung Lee, Tu-Chen, TW;
Dong Wang, Shenzhen, CN;
Li He, Shenzhen, CN;
ShengHua Wang, Shenzhen, CN;
Jian-Hua Gu, Shenzhen, CN;
Zhi-Gang Liu, Shenzhen, CN;
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Shenzhen, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, TW;
Abstract
A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body () defining a central chamber () therein and having a number of fins () on an outside thereof, liquid coolant received in the central chamber, a first fan () received in the central chamber, and a second fan () positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.