Tsuneyoshi Kawahito

Title: Tsuneyoshi Kawahito: Sputtering Process and Film-Formation Innovations

Introduction

Tsuneyoshi Kawahito is an inventor associated with Yokohama, Japan, and Hitachi, Ltd. His patent work focuses on sputtering technologies and methods for improving the formation of thin films. Kawahito is credited with 5 patents.

Latest Patents

Kawahito’s listed patents address sputtering processes and apparatuses designed to improve film quality and control how material is deposited.

“Sputtering Process and an Apparatus for Carrying Out the Same” describes a substrate-biasing system that periodically varies the bias potential. By changing the amplitude of the output from a radio-frequency or direct-current bias power supply, or by adjusting the duty factor of its voltage pulses, the process varies the kinetic energy of sputtering-gas ions reaching the substrate. The approach is intended to improve film coverage over stepped underlying layers.

“Sputtering Apparatus with Film Forming Directivity” introduces ways to control the flight directions of sputtered particles. The patent describes using recesses in the target surface or placing a frame between the target and substrate to guide deposition. It also describes an outer wall around the target to help use the plasma effectively. The technique is intended for applications that require additional films to be formed after microscopic patterns have been created.

Career Highlights

Kawahito’s listed inventions address two important aspects of sputtering: improving coverage over uneven surfaces and directing deposited material. These approaches offer ways to refine thin-film formation for applications involving patterned substrates.

Collaborations

Kawahito’s listed coworkers include Tsuneaki Kamei and Masao Mitani. His work is associated with Hitachi, Ltd.

Conclusion

Tsuneyoshi Kawahito’s patent portfolio highlights practical innovations in sputtering, with a focus on film coverage and deposition control for patterned surfaces.