Tsui-Ping Wang

Title: **The Innovative Contributions of Tsui-Ping Wang in Integrated Circuit Technology**

Introduction

Tsui-Ping Wang is a notable inventor based in Zhubei, Taiwan, recognized for his significant contributions to the field of integrated circuit technology. With a total of four patents to his name, Wang's innovative work reflects the cutting-edge advancements in three-dimensional integrated circuits (3D ICs). His inventions enhance the functionality and reliability of electronic devices, paving the way for future technological developments.

Latest Patents

Among Wang's recent innovations is the patent for “Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit.” This invention introduces a sophisticated 3D IC package, which comprises several key components: a first IC die with a substrate positioned at its backside, a second IC die stacked upon it, and a through-silicon via (TSV) that electrically connects the two ICs. This setup includes a TSV cell that contains a protection module, ensuring both antenna effect protection and electrostatic discharge protection. The design of this 3D IC package not only optimizes space but also enhances the durability and performance of the integrated circuits within electronic devices.

Career Highlights

Tsui-Ping Wang is currently affiliated with Taiwan Semiconductor Manufacturing Company Ltd., where he utilizes his expertise to innovate in semiconductor manufacturing. His work at TSMC includes leading projects aimed at advancing IC architecture and protecting against common vulnerabilities in electronic circuits. Wang's focus on improving the efficacy of 3D IC packages underscores his dedication to excellence in semiconductor innovation.

Collaborations

Throughout his career, Wang has collaborated with respected professionals in his field, including Po-Hsiang Huang and Fong-Yuan Chang. These collaborations reflect a synergy of ideas and expertise, contributing to the refinement and effectiveness of their collective projects. Working alongside these talented individuals has facilitated the development of pioneering solutions in the realm of integrated circuits.

Conclusion

In summary, Tsui-Ping Wang stands out as a prominent figure in the development of advanced integrated circuit technologies. His inventive spirit and collaboration with industry experts have led to valuable contributions such as the innovative 3D IC package designed to protect against antenna effects and electrostatic discharge. As the technology landscape continues to evolve, Wang's work will undoubtedly play an essential role in shaping the future of electronic components.