Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsui-Ping Wang

Po-Hsiang Huang

Fong-Yuan Chang

Yi-Shin Chu

Lee-Chung Lu

Chung-Hsing Wang

Cliff Hou

Chia-Lin Cheng

Hsing-Chien Huang

Yee-Wen Chen

A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit

A method and system for the design of an electronic device adjusts the resistance and capacitance values employed in preliminary timing analysis during physical synthesis of the electronic device. The physical synthesis uses resistance and capacitance unit values to determine the listing of the component circuits. The resistance and capacitance unit values are calibrated by preliminarily placing the initially synthesized component circuits to create a listing describing physical locations of the component circuits within the electronic device. A preliminary routing of the interconnections is performed to create a listing describing a network of physical wire segments that form each interconnection of the component circuits. A timing analysis of the electronic device determines the delay created by the component circuit and the networks of physical wire segments. The time delay resulting from the physical interconnects is extracted from the timing analysis of the electronic device and from the timing estimate performed during the physical synthesis. The time delay of the physical interconnection from the timing analysis and the timing estimate performed during the physical synthesis is then compared. The resistance and capacitance unit values used during the timing synthesis are then adjusted. The calibration is repeatedly executed until time delay of the physical interconnection from the timing analysis and the timing estimate performed during the physical synthesis are correlated.

Method and apparatus to perform resistance and capacitance (RC) parameter customization for better timing closure results in physical synthesis and optimization

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Zhubei, Taiwan

Tsui-Ping Wang