Hong Kong, China

Tsui-Kiu Li

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Rohm & Haas Electronic Materials LLC. Active years: 2016-2017.


 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Kowloon, CN (2016)
  • Hong Kong, CN (2017)

Company Filing History:


Years Active: 2016-2017

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Tsui-Kiu Li

Introduction

Tsui-Kiu Li is a notable inventor based in Hong Kong, CN. She has made significant contributions to the field of electroless plating, holding a total of 2 patents. Her work focuses on processes that enhance the application of metallization to non-conductive materials.

Latest Patents

Li's latest patents include a process for electroless plating and a solution used for the same. This innovative process involves a pretreatment for the selective application of electroless metallization to the surface of non-conductive materials. The solution provided in her patents achieves excellent coverage in areas designated for plating, effectively preventing issues such as skip plating or over plating.

Career Highlights

Tsui-Kiu Li is currently employed at Rohm & Haas Electronic Materials LLC, where she continues to develop her expertise in materials science and plating technologies. Her work has been instrumental in advancing the capabilities of electroless plating processes.

Collaborations

Li collaborates with talented coworkers, including Dennis Kwok-Wai Yee and Michael Chi-Yung Tang, who contribute to her innovative projects and research endeavors.

Conclusion

Tsui-Kiu Li's contributions to the field of electroless plating demonstrate her commitment to innovation and excellence. Her patents reflect her ability to solve complex problems in materials science, making her a valuable asset in her industry.

Profile summary based on public USPTO records.
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