The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Oct. 26, 2012
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Dennis Kwok-Wai Yee, Yuen Long, HK;
Michael Chi-Yung Tang, Tin Shui Wai, HK;
Martin W. Bayes, Hopkinton, MA (US);
Ka-Ming Yip, Tai Wai, HK;
Chun-Man Chan, Tsuen Wan, HK;
Hung-Tat Chan, Tin Shui Wai, HK;
Tsui-Kiu Li, Kowloon, HK;
Lok-Lok Liu, Kowloon, HK;
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/30 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/20 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1639 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1851 (2013.01); C23C 18/204 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01); C23C 18/38 (2013.01);
Abstract
A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.