This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Rohm & Haas Electronic Materials LLC. Active years: 2016-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Fanling, CN (2016)
- Hong Kong, CN (2017)
Company Filing History:
Years Active: 2016-2017
Title: The Innovations of Lok-Lok Liu
Introduction
Lok-Lok Liu is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of electroless plating, holding a total of 2 patents. His work focuses on processes that enhance the application of metallization to non-conductive materials.
Latest Patents
Lok-Lok Liu's latest patents include a process for electroless plating and a solution used for the same. This innovative process involves a pretreatment for selective application of electroless metallization to the surface of non-conductive materials. The solution provided in this patent achieves excellent coverage in areas designated for plating, effectively preventing issues such as skip plating or over plating.
Career Highlights
Liu is currently associated with Rohm & Haas Electronic Materials LLC, where he applies his expertise in materials science and engineering. His work has been instrumental in advancing the capabilities of electroless plating technologies.
Collaborations
Some of his notable coworkers include Dennis Kwok-Wai Yee and Michael Chi-Yung Tang, who have collaborated with him on various projects within the company.
Conclusion
Lok-Lok Liu's contributions to the field of electroless plating demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of materials and processes that enhance manufacturing capabilities.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile