Tokyo, Japan

Tsubasa Inoue

This inventor holds 1 USPTO granted patent. Top assignee: Showa Denko Materials Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsubasa Inoue. Retrieved from https://idiyas.com/inventor/tsubasa-inoue-q0k5mo95

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Tsubasa Inoue: Patent Inventor in Tokyo

Introduction

Tsubasa Inoue is an inventor based in Tokyo, Japan. His work includes a patented method and materials for producing multilayer printed wiring boards.

Latest Patents

The provided information lists 1 patent associated with Inoue: “Multilayer Printed Wiring Board Production Method, Adhesive Layer-Equipped Metal Foil, Metal-Clad Laminate, and Multilayer Printed Wiring Board.” The patent describes a production method for a multilayer printed wiring board involving three steps.

Career Highlights

Inoue is associated with Showa Denko Materials Co., Ltd. His patent concerns printed wiring board production and related materials, including adhesive layer-equipped metal foil and metal-clad laminates.

Collaborations

The listed coworkers associated with Inoue are Hitoshi Onozeki and Hiroshi Shimizu.

Conclusion

Tsubasa Inoue’s recorded patent work focuses on multilayer printed wiring board production and related materials, reflecting his contributions as an inventor in Tokyo.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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