The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Aug. 10, 2016
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Hitoshi Onozeki, Tokyo, JP;

Tsubasa Inoue, Tokyo, JP;

Katsuji Yamagishi, Tokyo, JP;

Hiroshi Shimizu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); G03F 7/20 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); C09J 163/00 (2006.01); G03F 7/26 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01); G03F 7/038 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); C09J 163/00 (2013.01); G03F 7/2002 (2013.01); G03F 7/26 (2013.01); H05K 3/007 (2013.01); H05K 3/0035 (2013.01); H05K 3/061 (2013.01); H05K 3/188 (2013.01); H05K 3/4644 (2013.01); H05K 3/4652 (2013.01); H05K 3/4682 (2013.01); G03F 7/038 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4673 (2013.01); H05K 2203/0562 (2013.01); H05K 2203/0723 (2013.01);
Abstract

Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3:


Find Patent Forward Citations

Onozeki, Hitoshi. (2021). Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board (U.S. Patent No. 10893616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10893616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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