The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Aug. 10, 2016
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Hitoshi Onozeki, Tokyo, JP;
Tsubasa Inoue, Tokyo, JP;
Katsuji Yamagishi, Tokyo, JP;
Hiroshi Shimizu, Tokyo, JP;
Assignee:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); G03F 7/20 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); C09J 163/00 (2006.01); G03F 7/26 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01); G03F 7/038 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); C09J 163/00 (2013.01); G03F 7/2002 (2013.01); G03F 7/26 (2013.01); H05K 3/007 (2013.01); H05K 3/0035 (2013.01); H05K 3/061 (2013.01); H05K 3/188 (2013.01); H05K 3/4644 (2013.01); H05K 3/4652 (2013.01); H05K 3/4682 (2013.01); G03F 7/038 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4673 (2013.01); H05K 2203/0562 (2013.01); H05K 2203/0723 (2013.01);
Abstract
Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: