Company Filing History:
Years Active: 2025-2026
Title: Tsubasa Hirose: Innovator in Wafer Processing Technology
Introduction
Tsubasa Hirose is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology, holding a total of 3 patents. His innovative approaches have the potential to enhance manufacturing processes in the semiconductor industry.
Latest Patents
Hirose's latest patents include a processing method that focuses on the efficient handling of workpieces. This method involves a protective wall forming step, where a laser beam is used to create shield tunnels that define the boundary between necessary and unnecessary regions of a workpiece. Following this, an unnecessary region removal step is executed to eliminate the unwanted parts of the workpiece.
Another notable patent is a wafer processing method that also utilizes laser technology. This method includes a shield tunnel forming step, where shield tunnels are created to facilitate the division of a wafer into individual device chips. The process is designed to ensure precision and efficiency in the manufacturing of semiconductor devices.
Career Highlights
Tsubasa Hirose is currently associated with Disco Corporation, a company known for its advanced semiconductor manufacturing equipment. His work at Disco Corporation has allowed him to apply his innovative ideas in a practical setting, contributing to the company's reputation as a leader in the industry.
Conclusion
Tsubasa Hirose's contributions to wafer processing technology exemplify the impact of innovation in the semiconductor field. His patents reflect a commitment to improving manufacturing processes, showcasing his role as a key inventor in this vital industry.