The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Oct. 26, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Tsubasa Hirose, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01);
Abstract

A wafer processing method includes a shield tunnel forming step of executing irradiation with a laser beam with a wavelength having transmissibility with respect to a wafer to form shield tunnels each including a fine pore and a modified tube that surrounds the fine pore, and a dividing step of applying an external force to the wafer to divide the wafer into individual device chips. The shield tunnel forming step includes a first shield tunnel forming step of successively forming the shield tunnels in one planned dividing line with interposition of at least intervals corresponding to one shield tunnel, and a second shield tunnel forming step of successively forming the shield tunnels in regions in which the intervals are provided in the planned dividing line.


Find Patent Forward Citations

Loading…