Tso-Hung Yeh

Title: Tso-Hung Yeh: Innovator in Circuit Board Technology

Introduction

Tso-Hung Yeh is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His innovative designs and methods have advanced the capabilities of electronic components.

Latest Patents

Tso-Hung Yeh's latest patents include a laminate circuit board with a multi-layer circuit structure. This invention features a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer, and a cover layer. The design improves junction adhesion through chemical bonding, allowing for a denser circuit without the need for roughening the circuit metal layer. Another notable patent is a method for manufacturing coreless substrates. This method involves creating detachable metal layers on a base, which are then developed into independent semi-products, enhancing the efficiency of coreless substrate production.

Career Highlights

Tso-Hung Yeh is currently employed at Kinsus Interconnect Technology Corp., where he continues to innovate in the field of electronic interconnects. His work has been instrumental in developing advanced circuit board technologies that meet the demands of modern electronics.

Collaborations

Throughout his career, Tso-Hung Yeh has collaborated with talented individuals such as Jun-Chung Hsu and Chi-Ming Lin. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Tso-Hung Yeh's contributions to circuit board technology exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of electronic components.