The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Apr. 18, 2006
Tso-hung Yeh, Yung-Ho, TW;
Tso-Hung Yeh, Yung-Ho, TW;
Kinsus Interconnect Technology Corp., Taoyuan, TW;
Abstract
A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-pad side or ball side wiring layers required by the coreless substrate simultaneously. The two metal layers along with their respective wiring layers are then separated from the base into two independent semi-products of the coreless substrate. The method then develops from the other sides of the two semi-products the laminate side wiring layers required by the coreless substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile