Company Filing History:
Years Active: 2016-2018
Title: Tseng-Chieh Pan: Innovator in Substrate Metallization
Introduction
Tseng-Chieh Pan is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of substrate surface metallization, holding a total of 2 patents. His work focuses on innovative methods for enhancing the properties of substrates used in various applications.
Latest Patents
Tseng-Chieh Pan's latest patents include a substrate surface metallization method and a substrate having a metallized surface manufactured by the same. The first patent describes a substrate that includes a silanated surface, an adhesive layer, and a first metallic layer bonded through the adhesive layer. The adhesive layer is formed with colloidal nanoparticle groups, which may include metallic nanoparticles capped with polymer. Additionally, the substrate may feature a second metallic layer that is electro-plated onto the first metallic layer. The second patent also outlines a similar substrate structure, emphasizing the importance of chemical bonds between the metallic layer and the adhesive layer.
Career Highlights
Tseng-Chieh Pan is affiliated with Tsinghua University, where he continues to advance research in substrate metallization. His innovative approaches have garnered attention in the academic and industrial sectors, contributing to the development of new materials and methods.
Collaborations
Some of his notable coworkers include Tzu-Chien Wei and Chih-Ming Chen, who collaborate with him on various research projects.
Conclusion
Tseng-Chieh Pan's work in substrate surface metallization showcases his commitment to innovation and excellence in the field. His patents reflect a deep understanding of material science and engineering, paving the way for future advancements.