The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Nov. 03, 2016
National Tsing Hua University, Hsinchu, TW;
Tzu-Chien Wei, Hsinchu, TW;
Chih-Ming Chen, Taichung, TW;
Tseng-Chieh Pan, Hsinchu, TW;
Kuei-Chang Lai, Taichung, TW;
Chung-Han Wu, Miaoli County, TW;
Kuei-Po Chen, Miaoli County, TW;
Nai-Tien Ou, Miaoli County, TW;
Cheng-You Hong, Taipei, TW;
NATIONAL TSING HUA UNIVERSITY, Hsinchu, TW;
Abstract
A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.