Jhunan, Taiwan

Nai-Tien Ou


Average Co-Inventor Count = 6.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Guanyin Shiang, TW (2010)
  • Jhunan Township, Miaoli County, TW (2011 - 2014)
  • Miaoli County, TW (2016 - 2018)

Company Filing History:


Years Active: 2010-2018

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5 patents (USPTO):Explore Patents

Title: Nai-Tien Ou: Innovator in Substrate Metallization

Introduction

Nai-Tien Ou is a prominent inventor based in Jhunan, Taiwan. He has made significant contributions to the field of substrate surface metallization, holding a total of five patents. His innovative work focuses on enhancing the properties and applications of substrates through advanced metallization techniques.

Latest Patents

One of Nai-Tien Ou's latest patents is titled "Substrate Surface Metallization Method and Substrate Having Metallized Surface Manufactured by the Same." This invention provides a substrate with a metallized surface that includes a silanated surface, an adhesive layer, and a first metallic layer bonded through the adhesive layer. The adhesive layer is composed of colloidal nanoparticle groups, which may include metallic nanoparticles capped with polymer. Additionally, the substrate can feature a second metallic layer that is electro-plated onto the first metallic layer. This method significantly improves the metallization process of substrates.

Career Highlights

Throughout his career, Nai-Tien Ou has worked with notable organizations such as Gintech Energy Corporation and Tsinghua University. His experience in these institutions has allowed him to collaborate with leading experts in the field and contribute to groundbreaking research and development.

Collaborations

Nai-Tien Ou has collaborated with several professionals, including Tien-Szu Chen and Tzu-Chien Wei. These partnerships have fostered innovation and have been instrumental in advancing the technology related to substrate metallization.

Conclusion

Nai-Tien Ou's contributions to substrate surface metallization demonstrate his commitment to innovation and excellence in the field. His patents and collaborations reflect a dedication to advancing technology and improving substrate applications.

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