Gintech Energy Corporation

Tsinghua University

Nai-Tien Ou

Tien-Szu Chen

Tzu-Chien Wei

Chih-Ming Chen

Kuei-Wu Huang

Ming-Chin Kuo

Tseng-Chieh Pan

Chung-Han Wu

Kuei-Po Chen

Kuei-Chang Lai

Ching-Tang Tsai

Kai-Sheng Chang

Hua-Hsuan Kuo

Chi-Cheng Lee

Yu-Chih Chan

Chen-Chan Wang

Chin-Chiang Huang

Li-Guo Wu

Jen-Ho Kang

Cheng-Yeh Yu

Cheng-You Hong

A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

Substrate surface metallization method and substrate having metallized surface manufactured by the same

A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.

An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Conductive channel of photovoltaic panel and method for manufacturing the same

A one-step diffusion method for fabricating a differential doped solar cell is described. The one-step diffusion method includes the following step. First, a substrate is provided. A doping control layer is formed on the substrate. The doping control layer includes a plurality of openings therein. A doping process is conducted on the substrate to form heavy doping regions under the openings of the doping control layer and light doping regions on the other portion of the substrate

One-step diffusion method for fabricating a differential doped solar cell

A method of fabricating a differential doped solar cell is described. The method includes the following steps. First, a substrate is provided. A doping process is conducted thereon to form a doped layer. A heavy doping portion of the doped layer is partially or fully removed. Subsequently, an anti-reflection coating layer is formed thereon. A metal conducting paste is printed on the anti-reflection coating layer and is fired to form the metal electrodes for the solar cell.

Method of fabricating a differential doped solar cell

Growing community of inventors

Jhunan, Taiwan

Nai-Tien Ou