The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
Dec. 03, 2015
National Tsing Hua University, Hsinchu, TW;
Tzu-Chien Wei, Hsinchu, TW;
Chih-Ming Chen, Taichung, TW;
Tseng-Chieh Pan, Hsinchu, TW;
Kuei-Chang Lai, Taichung, TW;
Chung-Han Wu, Miaoli County, TW;
Kuei-Po Chen, Miaoli County, TW;
Nai-Tien Ou, Miaoli County, TW;
Kuei-Wu Huang, Miaoli County, TW;
NATIONAL TSING HUA UNIVERSITY, Hsinchu, TW;
Abstract
A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.