Tsinghua University

Tseng-Chieh Pan

Tzu-Chien Wei

Chih-Ming Chen

Nai-Tien Ou

Kuei-Po Chen

Kuei-Chang Lai

Chung-Han Wu

Kuei-Wu Huang

Cheng-You Hong

A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

Substrate surface metallization method and substrate having metallized surface manufactured by the same

A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.

Growing community of inventors

Hsinchu, Taiwan

Tseng-Chieh Pan