This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignee: Xintec Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tsang Yu Liu: Chip Packaging Inventor
Introduction
Tsang Yu Liu is an inventor based in Zhubei, Taiwan. His patent work includes a chip package design that protects a chip’s sensing area while allowing light to pass through to it. Liu is associated with Xintec Corporation.
Latest Patents
Liu is credited with 1 patent: “Chip Package and Manufacturing Method Thereof.” The invention describes a carrier board holding a chip with a sensing area, a supporting element surrounding that area, and a light-transmissive sheet positioned above the support to cover the sensing area. Molding material surrounds the chip and sheet, with its top surface lower than the sheet’s top surface. The design provides a package structure that leaves the sensing area optically accessible.
Career Highlights
Liu’s listed patent highlights his work in semiconductor packaging, particularly in structures that accommodate chips with optical sensing areas. His association with Xintec Corporation connects his inventive work to the semiconductor industry.
Collaborations
The available information identifies Xintec Corporation as Liu’s company affiliation. It does not specify particular co-inventors, research partners, or other collaborators for the patent.
Conclusion
Tsang Yu Liu’s patent presents a chip packaging approach that combines protective molding with a light-transmissive cover over a chip’s sensing area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile