Company Filing History:
Years Active: 2016-2018
Title: Tsang-Jin Juo: Innovator in Copper Foil Technology
Introduction
Tsang-Jin Juo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. With a total of 3 patents to his name, Juo's work has implications for various applications, including printed circuit boards.
Latest Patents
Juo's latest patents include innovative methods for producing composite thin copper foils. One of his notable inventions is a method for creating composite foils and thin copper foils that can be peeled for use in printed circuit boards (PCB). This method allows for the lamination of either the composite foil or the thin copper foil to a polymer layer, enhancing the manufacturing process of PCBs. Another significant patent involves a copper foil with a matte side that is nickel plated, designed for use in Positive Temperature Coefficient (PTC) devices. This copper foil exhibits specific surface hardness and tensile strength, making it suitable for high-performance applications.
Career Highlights
Tsang-Jin Juo is currently employed at Chang Chun Petrochemical Co., Ltd., where he continues to innovate in the field of copper foil technology. His work has not only advanced the capabilities of copper foils but has also contributed to the efficiency of electronic devices.
Collaborations
Juo has collaborated with notable colleagues, including Kuei-Sen Cheng and Yao-Sheng Lai. These partnerships have fostered a collaborative environment that enhances the innovation process within the company.
Conclusion
Tsang-Jin Juo's contributions to copper foil technology demonstrate his commitment to innovation and excellence in materials science. His patents reflect a deep understanding of the industry's needs and a drive to improve manufacturing processes.