The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jan. 14, 2016
Applicant:

Chang Chun Petrochemical Co., Ltd., Taipei, TW;

Inventors:

Kuei-Sen Cheng, Taipei, TW;

Shih-Cheng Tseng, Taipei, TW;

Tsang-Jin Juo, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B32B 37/10 (2006.01); B32B 37/16 (2006.01); B32B 37/12 (2006.01); H01C 7/00 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
B32B 15/01 (2013.01); B32B 37/10 (2013.01); B32B 37/1284 (2013.01); B32B 37/16 (2013.01); C25D 7/0614 (2013.01); H01C 7/008 (2013.01); B32B 2311/12 (2013.01); B32B 2311/22 (2013.01); B32B 2457/00 (2013.01); H05K 2203/0307 (2013.01);
Abstract

A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 μs/dm. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg/mmand a shiny side surface roughness (Rz) not exceeding 2.0 μm. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 μm. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.


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