The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Feb. 02, 2017
Applicant:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Inventors:
Tsang-Jin Juo, Taipei, TW;
Kuei-Sen Cheng, Taipei, TW;
Yao-Sheng Lai, Taipei, TW;
Jui-Chang Chou, Taipei, TW;
Assignee:
CHANG CHUN PETROCHEMICAL CO., LTD., Taipei, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 3/28 (2006.01); C25D 3/38 (2006.01); C25D 5/48 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C25D 3/38 (2013.01); C25D 5/48 (2013.01); C25D 7/00 (2013.01); H05K 3/007 (2013.01); H05K 3/188 (2013.01); H05K 3/28 (2013.01); H05K 2201/05 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/1545 (2013.01);
Abstract
A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.