The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Oct. 04, 2013
Applicant:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Inventors:
Kuei-Sen Cheng, Taipei, TW;
Yao-Sheng Lai, Taipei, TW;
Tsang-Jin Juo, Taipei, TW;
Jui-Chang Chou, Taipei, TW;
Hsi-Hsing Lo, Taipei, TW;
Yueh-Min Liu, Taipei, TW;
Assignee:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/02 (2006.01); C11D 11/00 (2006.01); B32B 15/01 (2006.01); C11D 7/10 (2006.01); C25D 1/04 (2006.01); B08B 3/08 (2006.01); C25D 7/06 (2006.01); C25D 11/38 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0029 (2013.01); B08B 3/08 (2013.01); B32B 15/01 (2013.01); C11D 7/10 (2013.01); C25D 1/04 (2013.01); C25D 7/0614 (2013.01); C25D 11/38 (2013.01); Y10T 428/12729 (2015.01);
Abstract
An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.