Garland, TX, United States of America

Troy D Moore


Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1976-1998

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Troy D Moore

Introduction

Troy D Moore is a notable inventor based in Garland, TX (US), recognized for his significant contributions to the field of electronic device packaging. With a total of 4 patents to his name, Moore has developed innovative solutions that enhance the functionality and reliability of electronic components.

Latest Patents

Among his latest patents, the "J-lead conditioning method and apparatus" stands out. This invention addresses the issue of bowed-in J-leads in electronic device packages. The method involves inserting a comb-like tooth with a graduating-width edge between the bowed-in J-lead and the electronic device package. This innovative approach allows for the correction of the bowed-in condition by adjusting the spacing of the J-lead. Another significant patent is the "Programmable lead conditioner," which features a lead conditioning system that utilizes a rotary table to hold electronic component packages. This system includes a conditioning tool that selectively contacts and conditions the leads of the package, ensuring optimal performance.

Career Highlights

Throughout his career, Troy D Moore has worked with prominent companies in the electronics industry. Notably, he has been associated with Texas Instruments Corporation and Semiconductor Technologies & Instruments Pte. Ltd. His experience in these organizations has contributed to his expertise in electronic device packaging and lead conditioning technologies.

Collaborations

Moore has collaborated with several talented individuals in his field, including Dennis M Botkin and James E Loveless. These collaborations have likely fostered innovation and the exchange of ideas, further enhancing the quality of his inventions.

Conclusion

Troy D Moore's contributions to electronic device packaging through his innovative patents demonstrate his commitment to advancing technology in the industry. His work continues to influence the design and functionality of electronic components, making him a significant figure in the field of invention.

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