The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
Sep. 24, 1997
Troy D Moore, Garland, TX (US);
Dennis M Botkin, Seagoville, TX (US);
Semiconductor Technologies & Instruments, Inc., Dallas, TX (US);
Abstract
An electronic device package lead conditioning method and system corrects bowed-in J-leads (36) of an electronic device package (30) by inserting between a bowed-in J-lead (36) and electronic device package (36) a comb-like tooth (42) having a graduating-width edge, the graduating width edge graduating from a minimum width (112) to a maximum width (114). The minimum width permits the graduating width edge (112) to be inserted into a space (110) separating the bowed-in J-lead (36) from electronic device package (30). The maximum width (114) at least equals the width of a desired spacing for the bowed-in J-lead (36) from the electronic device package (30) for correcting for the bowed-in-condition of the bowed-in J-lead (36).