Dennis M Botkin

Title: Dennis M Botkin: Innovator in Electronic Device Packaging

Introduction

Dennis M Botkin is a notable inventor based in Seagoville, TX (US). He has made significant contributions to the field of electronic device packaging, holding a total of 3 patents. His innovative approaches have led to advancements in lead conditioning methods and systems.

Latest Patents

One of his latest patents is the "J-lead conditioning method and apparatus." This invention addresses the issue of bowed-in J-leads in electronic device packages. The method involves inserting a comb-like tooth with a graduating-width edge between the bowed-in J-lead and the electronic device package. This design allows for correction of the bowed-in condition by adjusting the spacing of the J-lead. Another significant patent is the "Programmable lead conditioner." This system conditions the leads of electronic component packages using a rotary table and a conditioning tool that selectively contacts the leads. The control system manages the operation of the manipulator, ensuring precise conditioning of the leads.

Career Highlights

Throughout his career, Dennis has worked with prominent companies in the industry. He has been associated with Semiconductor Technologies & Instruments Pte. Ltd. and Texas Instruments Corporation. His experience in these organizations has contributed to his expertise in electronic device packaging.

Collaborations

Dennis has collaborated with several professionals in his field, including Troy D Moore and James E Loveless. These collaborations have likely enriched his work and led to further innovations in electronic device packaging.

Conclusion

Dennis M Botkin is a distinguished inventor whose work in electronic device packaging has led to valuable patents and advancements in the industry. His innovative methods and systems continue to influence the field, showcasing his commitment to improving electronic device technology.