Kawasaki, Japan

Toyoji Sawada

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 61(Granted Patents)


Location History:

  • Kawasaki, JP (2004 - 2013)
  • Kanagawa, JP (2022)
  • Yokohama, JP (2012 - 2024)

Company Filing History:


Years Active: 2004-2024

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14 patents (USPTO):Explore Patents

Title: The Innovations of Toyoji Sawada

Introduction

Toyoji Sawada is a prominent inventor based in Kawasaki, Japan, known for his significant contributions to the field of semiconductor technology. With a total of 14 patents to his name, Sawada has made remarkable advancements that have influenced the production of semiconductor devices and packages.

Latest Patents

Among his latest patents, Sawada has developed a method for producing semiconductor devices and packages. This innovative method involves dicing a semiconductor wafer at a scribe area into semiconductor chips, which include respective circuit areas. The scribe area is strategically placed between the circuit areas and extends in a specific direction. The method also includes the removal of portions of monitor pads by emitting a laser beam to the second areas before the dicing process. This technique enhances the efficiency and precision of semiconductor production.

Career Highlights

Throughout his career, Toyoji Sawada has worked with notable companies such as Fujitsu Corporation and Socionext Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations

Sawada has collaborated with esteemed colleagues, including Kazuo Sukegawa and Kenichi Watanabe. These partnerships have fostered an environment of innovation and creativity, leading to the development of advanced semiconductor solutions.

Conclusion

Toyoji Sawada's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents and collaborations have significantly impacted the industry, paving the way for future advancements in semiconductor devices and packages.

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