The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Feb. 13, 2006
Kenichi Watanabe, Kawasaki, JP;
Michiari Kawano, Kawasaki, JP;
Hiroshi Namba, Kawasaki, JP;
Kazuo Sukegawa, Kawasaki, JP;
Takumi Hasegawa, Kawasaki, JP;
Toyoji Sawada, Kawasaki, JP;
Kenichi Watanabe, Kawasaki, JP;
Michiari Kawano, Kawasaki, JP;
Hiroshi Namba, Kawasaki, JP;
Kazuo Sukegawa, Kawasaki, JP;
Takumi Hasegawa, Kawasaki, JP;
Toyoji Sawada, Kawasaki, JP;
Fujitsu Microelectronics Limited, Tokyo, JP;
Abstract
A main wall part is provided so as to surround an integrated circuit part. A sub-wall part which is in 'L' shape is provided between each corner of the main wall part and the integrated circuit part. Therefore, even if the stress is concentrated due to heat treatment or the like, the stress is dispersed to the main wall part and the sub-wall part, and hence peeling between layers and a crack are unlikely to occur, as compared with the conventional art. Further, even if the crack and the like occur at the corner, moisture from the outside hardly reaches the integrated circuit part when the main wall part and the sub-wall part are coupled to each other. For this reason, it is possible to ensure an extremely high moisture resistance.