The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Apr. 21, 2010
Kenichi Watanabe, Kawasaki, JP;
Michiari Kawano, Kawasaki, JP;
Hiroshi Namba, Kawasaki, JP;
Kazuo Sukegawa, Kawasaki, JP;
Takumi Hasegawa, Kawasaki, JP;
Toyoji Sawada, Kawasaki, JP;
Kenichi Watanabe, Kawasaki, JP;
Michiari Kawano, Kawasaki, JP;
Hiroshi Namba, Kawasaki, JP;
Kazuo Sukegawa, Kawasaki, JP;
Takumi Hasegawa, Kawasaki, JP;
Toyoji Sawada, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A method of manufacturing a semiconductor device including an integrated circuit part in which an integrated circuit is formed and a main wall part including metal films surrounding said integrated circuit part, includes the step of selectively forming a sub-wall part including metal films between the integrated circuit part and the main wall part, in parallel to formation of the integrated circuit part and the main wall part. A sub-wall part which is in an 'L' shape is provided between each corner of the main wall part and the integrated circuit part of the resulting semiconductor device.