Toshiyuki Oshima

Title: Innovations of Toshiyuki Oshima: A Pioneer in Adhesive Technology

Introduction

Toshiyuki Oshima is a prominent inventor based in Osaka, Japan, known for his significant contributions in the field of pressure-sensitive adhesive technology. With a remarkable portfolio of nine patents, Oshima has played a vital role in advancing adhesive materials suited for various applications, particularly in the electronics industry.

Latest Patents

Oshima's latest patents revolve around innovative designs of heat-peelable pressure-sensitive adhesive sheets. One such patent describes a heat-peelable pressure-sensitive adhesive sheet, which includes a base material and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres. This layer features a surface optimized for adhesion to various adherends, characterized by a centerline average roughness of over 0.4 μm and a distinct convex structure from the microspheres.

Another patent reveals a similar heat-peelable adhesive sheet that minimizes contamination during the heat treatment process intended to reduce adhesive force. This adhesive sheet incorporates a heat-expandable layer combined with a non-heat expandable pressure-sensitive adhesive layer. This innovative design demonstrates excellent adhesive properties prior to heating while efficiently decreasing adhesive strength upon exposure to heat, making it advantageous for the production of thinner semiconductor wafers and electronic components.

Career Highlights

Throughout his career, Toshiyuki Oshima has collaborated with notable companies such as Nitto Denko Corporation, a leader in the field of adhesive manufacturing. His work has focused on creating effective adhesive solutions for various industrial applications, blending scientific research with practical needs.

Collaborations

In his professional journey, Oshima has worked alongside esteemed colleagues, including Akihisa Murata and Yukio Arimitsu. Their collaborative efforts have led to innovative breakthroughs and refinements in adhesive technologies, highlighting the importance of teamwork in achieving substantial advancements in their field.

Conclusion

Toshiyuki Oshima's impact on adhesive technology is underscored by his patented innovations and valuable contributions to the industry. His work continues to influence the design and application of pressure-sensitive adhesives, particularly in the high-tech arena of electronics. With ongoing advancements, Oshima remains a key figure in the pursuit of innovative adhesive solutions.