The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Feb. 14, 2001
Kazuyuki Kiuchi, Osaka, JP;
Toshiyuki Oshima, Osaka, JP;
Akihisa Murata, Osaka, JP;
Yukio Arimitsu, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.