The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2007
Filed:
Apr. 02, 2003
Akihisa Murata, Osaka, JP;
Toshiyuki Oshima, Osaka, JP;
Yukio Arimitsu, Osaka, JP;
Kazuyuki Kiuchi, Osaka, JP;
Akihisa Murata, Osaka, JP;
Toshiyuki Oshima, Osaka, JP;
Yukio Arimitsu, Osaka, JP;
Kazuyuki Kiuchi, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 μm or less.