Hadano, Japan

Toshitada Netsu


Average Co-Inventor Count = 5.8

ph-index = 5

Forward Citations = 123(Granted Patents)


Location History:

  • Hatano, JP (1992)
  • Hadano, JP (1992 - 2009)

Company Filing History:


Years Active: 1992-2009

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Toshitada Netsu

Introduction

Toshitada Netsu is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of multi-chip modules, holding a total of 6 patents. His work focuses on enhancing the performance and reliability of semiconductor devices through innovative sealing and cooling technologies.

Latest Patents

Netsu's latest patents include a "Sealing Structure for Multi-Chip Module" and a "Device for Sealing and Cooling Multi-Chip Modules." The sealing structure aims to provide stability in cooling performance while excelling in sealing reliability. It features a frame compatible with a wiring board, which is fixed with solder to the wiring board's face for mounting semiconductor devices. A rubber O-ring is strategically placed to enhance the sealing between the frame and the heat sink. The design also incorporates a plastic member that allows for relative sliding, ensuring optimal performance.

The second patent, the device for sealing and cooling multi-chip modules, utilizes a ceramic sealing top plate with high thermal conductivity. This plate has a thermal expansion coefficient that aligns with that of a multi-layer circuit substrate. The invention includes a cooling flow path cover and a thermal-conductive jacket, which work together to minimize thermal resistance and improve the overall efficiency of the multi-chip module.

Career Highlights

Throughout his career, Toshitada Netsu has worked with prominent companies such as Hitachi, Ltd. and Hitachi Information Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Netsu has collaborated with talented individuals in the field, including Takahiro Daikoku and Kenichi Kasai. These partnerships have contributed to the advancement of his inventions and the successful implementation of his patented technologies.

Conclusion

Toshitada Netsu's contributions to the field of multi-chip modules demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in semiconductor technology and provide effective solutions to enhance performance and reliability.

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