Hitachi, Ltd.

Hitachi Information Technology Co., Ltd.

Toshitada Netsu

Takahiro Daikoku

Kenichi Kasai

Takayuki Uda

Hideaki Sasaki

Ryohei Satoh

Mitugu Shirai

Takaji Takenaka

Koichi Koyano

Masahide Harada

Fumiyuki Kobayashi

Takeshi Yamaguchi

Kiyoshi Matsui

Hiromi Tosaki

Norio Sengoku

Kouichi Takahashi

Kenichi Hamamura

Takahiko Matsushita

Osamu Maruyama

Kazutoshi Takahashi

A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a framecompatible with a wiring boardin thermal expansion rate is fixed with solderto the face of the wiring boardfor mounting semiconductor devices; a rubber O-ringis placed between the upper face of the frameand the under face of the circumference of an air-cooled: heat sink; the plastic membermaking possible relative sliding is placed between the upper face of the circumference of the heat sinkand the upper frame; the upper face of a plastic memberis restrained with the inside middle stage of an upper frame; and the lower part of the upper frameand the frameare fastened together with bolts

Sealing structure for multi-chip module

According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Device for sealing and cooling multi-chip modules

A semiconductor device-mounting substrate is provided with a semiconductor device, a capacitor device, and a wiring substrate. The wiring substrate has a space in which the capacitor device should be located, and the capacitor device is locate in the space. Terminals of a driving power supply wiring for the semiconductor device are provided on a surface of the space, and the terminals are connected with the capacitor device.

Structure for mounting a semiconductor device and a capacitor device on a substrate

An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

Electronic circuit apparatus comprising a structure for sealing an

An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

Electronic circuit device, method of connecting with solder and solder

Growing community of inventors

Hadano, Japan

Toshitada Netsu