The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Jun. 09, 2000
Kouichi Takahashi, Sagamihara, JP;
Kenichi Kasai, Ushiku, JP;
Takahiro Daikoku, Ushiku, JP;
Takayuki Uda, Hadano, JP;
Toshitada Netsu, Hadano, JP;
Takeshi Yamaguchi, Hadano, JP;
Takahiko Matsushita, Hadano, JP;
Osamu Maruyama, Hadano, JP;
Kouichi Takahashi, Sagamihara, JP;
Kenichi Kasai, Ushiku, JP;
Takahiro Daikoku, Ushiku, JP;
Takayuki Uda, Hadano, JP;
Toshitada Netsu, Hadano, JP;
Takeshi Yamaguchi, Hadano, JP;
Takahiko Matsushita, Hadano, JP;
Osamu Maruyama, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Information Technology Co., Ltd., Kanagawa, JP;
Abstract
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a framecompatible with a wiring boardin thermal expansion rate is fixed with solderto the face of the wiring boardfor mounting semiconductor devices; a rubber O-ringis placed between the upper face of the frameand the under face of the circumference of an air-cooled: heat sink; the plastic membermaking possible relative sliding is placed between the upper face of the circumference of the heat sinkand the upper frame; the upper face of a plastic memberis restrained with the inside middle stage of an upper frame; and the lower part of the upper frameand the frameare fastened together with bolts