Company Filing History:
1 out of 42,517 
1 out of 21 Years Active: 2009
Title: Osamu Maruyama: Innovator in Multi-Chip Module Technology
Introduction
Osamu Maruyama is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the design of sealing structures for multi-chip modules. His innovative approach has led to advancements in cooling performance and sealing reliability.
Latest Patents
Maruyama holds a patent for a sealing structure for multi-chip modules. This invention provides a stable cooling performance while excelling in sealing reliability. The design includes a frame compatible with a wiring board, which is fixed with solder to the face of the wiring board for mounting semiconductor devices. A rubber O-ring is strategically placed between the upper face of the frame and the under face of the circumference of an air-cooled heat sink. Additionally, a plastic member allows for relative sliding between the upper face of the circumference of the heat sink and the upper frame. The upper face of the plastic member is restrained with the inside middle stage of the upper frame, and the lower part of the upper frame and the frame are fastened together with bolts. This innovative sealing structure enhances the overall performance of multi-chip modules.
Career Highlights
Throughout his career, Osamu Maruyama has worked with prominent companies such as Hitachi, Ltd. and Hitachi Information Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor technologies.
Collaborations
Maruyama has collaborated with notable colleagues, including Kouichi Takahashi and Kenichi Kasai. Their combined efforts have contributed to advancements in the field of semiconductor technology.
Conclusion
Osamu Maruyama's contributions to the development of sealing structures for multi-chip modules demonstrate his innovative spirit and technical expertise. His work continues to influence the semiconductor industry, paving the way for future advancements.