Toshinari Takada

Title: Toshinari Takada: Innovator in Wiring Pattern Technology

Introduction

Toshinari Takada is a notable inventor based in Hadano, Japan. He has made significant contributions to the field of wiring pattern technology, holding a total of 3 patents. His innovative methods have advanced the efficiency and effectiveness of circuit design and manufacturing.

Latest Patents

One of his latest patents is a "Method for forming wiring pattern." This method focuses on reducing side etch of a wiring pattern during the etching of substrate copper foil, which helps to minimize line resistance. The process involves providing a plating resist pattern on a copper-clad laminate, plating the open area with copper, and etching away the copper foil using a solder film as an etching resist.

Another significant patent is the "Process for the formation of a conductive circuit pattern." This process outlines the steps for creating a conductive circuit pattern on a base metal formed on a substrate. It includes applying a plating resist in a pattern corresponding to the desired circuit, treating the resist with a stripper, and etching the base metal to remove any resist residue.

Career Highlights

Toshinari Takada is currently employed at Hitachi, Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the capabilities of electronic components and circuit designs.

Collaborations

Throughout his career, Takada has collaborated with esteemed colleagues such as Haruo Akahoshi and Akio Takahashi. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Toshinari Takada's contributions to wiring pattern technology and his innovative patents have made a lasting impact on the industry. His work at Hitachi, Ltd. and collaborations with other experts highlight his commitment to advancing technology.