The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 1994
Filed:
Sep. 21, 1992
Haruo Akahoshi, Hitachi, JP;
Toshinari Takada, Hadano, JP;
Fujiko Yutani, Hitachi, JP;
Takeyuki Itabashi, Hitachi, JP;
Shin Nishimura, Katsuta, JP;
Satoru Amo, Hitachi, JP;
Akio Takahashi, Hitachiota, JP;
Rituji Toba, Hadano, JP;
Masashi Miyazaki, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.