Toshihiko Satoh

Title: The Innovations of Toshihiko Satoh

Introduction

Toshihiko Satoh is a notable inventor based in Sayama, Japan, recognized for his contributions to semiconductor technology. He holds three patents that reflect his innovative approach to memory systems and packaging methods. His work has significantly impacted the field of integrated circuits and memory systems.

Latest Patents

Satoh's latest patents include a wafer scale or full wafer memory system and a packaging method thereof. This invention aims to achieve higher packaging density and one wafer level for a full-sized wafer memory. The wafers are vertically stacked at predetermined intervals, allowing for a precise memory system layout and the formation of accurate through holes. Additionally, other chips are fixed on the wafer to enhance packaging density. Another significant patent involves a semiconductor integrated circuit device and a method of fabricating the same. In this design, a semiconductor chip is face-down bonded to a package substrate through solder bumps, covered with a cap, and hermetically sealed using sealing solder. The back of the semiconductor chip is closely bonded to the underside of the cap using a solder for heat transfer, which is heat-melted to ensure a hermetic seal.

Career Highlights

Throughout his career, Toshihiko Satoh has worked with prominent companies such as Hitachi, Ltd. and Hitachi Hokkai Semiconductor Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Some of his notable coworkers include Masanori Tazunoki and Hiromitsu Mishimagi. Their collaboration has contributed to the advancement of technology in the semiconductor field.

Conclusion

Toshihiko Satoh's contributions to the field of semiconductor technology through his patents and career achievements highlight his role as an influential inventor. His innovative approaches continue to shape the future of memory systems and integrated circuits.