The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1993
Filed:
Dec. 13, 1990
Masanori Tazunoki, Nishitama, JP;
Hiromitsu Mishimagi, Akishima, JP;
Makoto Homma, Nishitama, JP;
Toshiyuki Sakuta, Nishitama, JP;
Hisashi Nakamura, Ohme, JP;
Keiji Sasaki, Musashino, JP;
Minoru Enomoto, Tokorozawa, JP;
Toshihiko Satoh, Sayama, JP;
Kunizo Sahara, Nishitama, JP;
Shigeo Kuroda, Ohme, JP;
Kanji Otsuka, Higashiyamato, JP;
Masao Kawamura, Fuchu, JP;
Hinoko Kurosawa, Hino, JP;
Kazuya Ito, Kodaira, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.