Company Filing History:
Years Active: 1990-1994
Title: Innovations by Hinoko Kurosawa
Introduction
Hinoko Kurosawa is a notable inventor based in Hino, Japan. He has made significant contributions to the field of memory systems, holding three patents to his name. His work focuses on enhancing packaging density and efficiency in wafer-scale integration memory systems.
Latest Patents
Kurosawa's latest patents include a wafer scale or full wafer memory system and its packaging method. This innovation aims to achieve higher packaging density by vertically stacking wafers at predetermined intervals. The improved packaging technique allows for precise memory system layouts and the formation of accurate through holes. Additionally, other chips are fixed onto the wafer to further enhance packaging density.
Career Highlights
Hinoko Kurosawa is currently employed at Hitachi, Ltd., where he continues to develop cutting-edge technologies in memory systems. His expertise in wafer-scale integration has positioned him as a key player in the industry.
Collaborations
Kurosawa has collaborated with notable colleagues such as Hisashi Nakamura and Masanori Tazunoki. Their combined efforts have contributed to advancements in memory technology.
Conclusion
Hinoko Kurosawa's innovative work in wafer-scale memory systems exemplifies the potential for advancements in technology through collaboration and creativity. His contributions are paving the way for more efficient memory solutions in the future.